Mountain ViewFull TimeEngineering
Remotely
signal integritythermal mechanical analysispciepower integrityserdesoptical packaging2d/3d packagingdie to die
Job Description
📋 Description
- Own development of advanced packaging solutions from concept to product release.
- Translate complex requirements into precise packaging specifications balancing performance, cost
- Serve as a technical decision-maker driving architecture trade-offs across product lifecycle.
- Collaborate with cross-functional teams across substrate design, signal integrity, and power
- Engage with product teams and customers in data center and HPC segments to influence roadmap.
🎯 Requirements
- Ph.D. or Master’s in Electrical, Mechanical, Materials Science, or related field.
- 15+ years in advanced (2D/3D) packaging with exposure to optical packaging.
- 10+ years in power/signal integrity, thermal-mechanical analysis, or optical packaging.
- System-level trade-off experience across silicon, package, and board for complex products.
- Extensive experience with high-speed interfaces (SERDES, PCIe, die-to-die) and impact on substrate
- Proven track record delivering packages from concept to production release.
🎁 Benefits
- Comprehensive Health Care Plan (Medical, Dental & Vision)
- Retirement Savings Matching Program
- Life Insurance (Basic, Voluntary & AD&D)
- Generous Time Off (Vacation, Sick & Public Holidays)
- Paid Family Leave
- Short Term & Long Term Disability
