Job Description
📋 Description Lead end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products Develop and optimize package architectures for manufacturability and long-term reliability Define test chip requirements and manage design for 3D package development Develop and validate high-yield assembly design rules and perform experiments with partners Collaborate with designers, silicon/photonics foundries, and OSAT partners to ensure Communicate findings and methodologies to stakeholders and document results 🎯 Requirements MS or PhD in Mechanical Engineering, Materials Science, or related field Experience in wafer-scale packaging assembly process development Knowledge of 2D/3D packaging technologies, materials, and equipment Ability to define requirements for test chips and assembly test vehicles Understanding of photonics packaging including fiber attach methods Experience with advanced packaging technologies (thermal, mechanical, reliability) 🎁 Benefits Comprehensive Health Care Plan (Medical, Dental & Vision) Retirement Savings Matching Life Insurance, Disability, and Paid Time Off Training & Development and Commuter Benefits Flexible, hybrid workplace model and Equity grants
