ASIC Package SI/PI Engineer

📋 Description

• OpenAI’s Hardware team builds AI-native silicon and systems for advanced AI workloads.
• Role focuses on electrical architecture, modeling, optimization, and validation for high-speed
• Specializes in 2.5D/3D SI/PI, PDN optimization, and SerDes/memory channel architecture.
• Collaborates with ASIC, package, system, mechanical, thermal, power, and silicon validation teams.

🎯 Requirements

• 5+ years in signal integrity and power integrity, high-speed interconnect and PDN design.
• Strong fundamentals in transmission lines, impedance, loss, crosstalk, return paths, PDN
• Hands-on with electromagnetic/SI/PI tools: Synopsys HSPICE, Ansys EDT, HFSS-PI, SIwave, Cadence
• Experience with package layouts (Cadence APD/SIP) and automated design optimization flows.
• Ability to communicate across ASIC, package, PCB, system, mechanical, thermal, power, validation

🎁 Benefits

• Equity options in compensation package.
• Competitive salary with equity value.